Grinding Machine

～In-line grinder  for less than 25um～

In-line Back grinder

GDM300

※Photo shown with optional accessories.

SERIES line-up

GDM300

CONCEPT

For thin wafer, Grinding/Polishing/Detape fully automatic  process by 1 machine.

Feature

・The process from back grinding to wafer mounting  continuously by fully automatic system, which enable to grind till 25um thickness.

・With 2 head polishing stage, throughput is almost double compared with 1 polish head system.

・Built in edge trimming system is available as an option for thin wafer process.

・Dual index system, which polishing stage and grinding stage is completely separated, 

satisfy the cleanness required for TSV and MEMS process.

・Less than  Ra1Å ultra luminance, ultra mirror surface is possible.

Specification

GDM300 standard specification

Grinding Machine

～200mm/300mm back grinder～

※Photo shown with optional accessories.

SERIES line-up

GNX200B・GNX300B

CONCEPT

Back grinder best seller

Feature

・Back grinder best seller features index table and down feed grinding.

Various process is available by adding  coin stack unit and stress relief equipment, which flexibly correspond to the process progression.

Specification

GNX200B/GNX300B standard specification

Wafer Scanning polisher

～Pioneer of stress relief equipment～

300mm polisher 

GNX12PB

(GNX300B Inline connection specification)

※Photo shown with optional accessories.

SERIES line-up

GNX8PB/GNX12PB

Feature

・Air back presser system and scanning polish  remove the grinding damage evenly.

・As  option, Coin stack unit is available for thin wafer.

・It can be used as a stand alone machine not only in-line system with grinder, which satisfy the various type low volume products request.

Specification

GNX8PB/GNX12PB standard specification

Grinding Machine

～Ultimate machine for TTV 「0」～ 

Ultra accurate back grinder

SVG202MKⅡ

※Photo shown with optional accessories.

SERIES line-up

SVG202MKⅡ

CONCEPT

SOI and Bonded wafer dedicated grinder.

Feature

・Grinder for dedicated SOI wafer, which needs ultimate TTV level.

・Each machine component adopt the low expansion material and avoid the Chronological change by thermal deformation.

Removal amount control soft wafer is available as an option, which enable submicron level layer thickness control with no effect of substrate thickness variation.

Specification

SVG202MKⅡ standard specification

Grinding Machine

～Small lay out and various function～

Grinder for brittle material

SVG401MKⅡ

※Photo shown with optional accessories.

SERIES line-up

SVG101MKⅡ・SVG401MKⅡ・SVG401H

CONCEPT

Best solution for brittle material grinder.

Feature

・Brittle material manual grinder for   R&D purpose SVG101 series has shuttle table and easy to put the wafer on/off.

・VG401 series has high rigid spindle design and high power built in motor, which is enable to continuous grinding for brittle material like sapphire and SiC or compound material.

MAX φ450mm wafer chuck table is available for small size wafer batch process(φ3inch wafer ×20 batch).

Specification

SVG standard specification

Please contact us for various inquiries and information on the products of Okamoto Machine Tool Manufacturing Co., Ltd. from the following.